Method of applying an encapsulant material to an ink jet printhead

A method of applying an encapsulant material to an ink jet print cartridge by stencil printing comprises providing a stencil having at least one aperture, providing an ink jet cartridge and stencil printing an encapsulant material onto an outer portion of the ink jet print cartridge thereby forming a layer of encapsulant material 44 to protect electrical components or other printhead components. The print cartridge preferably includes a flexible circuit with electrical traces 30 connected to a heater chip 32 and nozzle plate 18 assembly. The encapsulant protecting the connection bonds between the flexible circuit and heater chip. The electrical traces 30 are preferably tape automated bonded (TAB). The encapsulant is preferably a polymeric curable material having a final thickness between 0.001 inch (0.025 mm) and 0.015 inches (0.381 mm).