Imaging Device

An imaging device such as a CMOS image sensor (200) has a cover (240) attached to a standoff (220) surrounding a micro-lens array (210). Standard wafer processing fabricates the standoff (220) (e.g., out of photoresist) and attaches the cover (240). The standoff (220) maintains a gap over the micro-...

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Bibliographische Detailangaben
Hauptverfasser:	PATRICIA E JOHNSON, DAVID S PITOU, MOHAMMAD A SAFAI, ERIC J BARTON, JAMES P ROLAND
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An imaging device such as a CMOS image sensor (200) has a cover (240) attached to a standoff (220) surrounding a micro-lens array (210). Standard wafer processing fabricates the standoff (220) (e.g., out of photoresist) and attaches the cover (240). The standoff (220) maintains a gap over the micro-lenses (130). An adhesive attaches the cover (240) to the standoff (220) and can be kept away from the micro-lenses (130) by a barrier (330) having a structure similar to the standoff (220). Particles in the adhesive can prevent the adhesive from squeezing out from between the cover (240) and the standoff (220) during attachment.