Slosh suppressor and heat sink

A slosh suppressor prevents damage to electronic components and wire bonds of a circuit module 40 contained in a circuit chamber 30 formed by the housing 22 of a sensor module 20. The circuit module is positioned within the circuit chamber and has a silicon gel layer 66 positioned thereon for protec...

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Bibliographische Detailangaben
Hauptverfasser:	ERIC CHRISTOPHER MYERS, LAWRENCE A ZUREK
Format:	Patent
Sprache:	eng
Schlagworte:	ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILSOF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSTRUMENT DETAILS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL METERING BY VOLUME PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TARIFF METERING APPARATUS TESTING
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Beschreibung
Zusammenfassung:	A slosh suppressor prevents damage to electronic components and wire bonds of a circuit module 40 contained in a circuit chamber 30 formed by the housing 22 of a sensor module 20. The circuit module is positioned within the circuit chamber and has a silicon gel layer 66 positioned thereon for protecting the circuit module from the environment. A housing cover 50 is structured to engage the sensor housing and close the circuit chamber. The housing cover has a projection 56 extending into the circuit chamber and engaging the silicon gel layer 66 to reduce vibration in the silicon gel layer and protect the circuit module.