Creating layers in thin-film structures

A layer of a material is created in a thin-film structure by coating a substrate 14 in one pass with an ink having a major, fugitive component 13 and at least one minor, non-fugitive component 12 and treating the ink to expel the major component 13 to leave the layer 15 of material. The layer 15 may...

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Bibliographische Detailangaben
Hauptverfasser:	WARREN LEE, MICHAEL STUART WAITE, RICHARD ALLAN TUCK, ADRIAN PAUL BURDEN
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES ARTIFICIAL STONE CEMENTS CERAMICS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMICAL PAINT OR INK REMOVERS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE CORRECTING FLUIDS DIFFUSION TREATMENT OF METALLIC MATERIAL DYES FILLING PASTES GLASS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INKS JOINING GLASS TO GLASS OR OTHER MATERIALS LIME, MAGNESIA METALLURGY MINERAL OR SLAG WOOL MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES REFRACTORIES SLAG SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TREATMENT OF NATURAL STONE USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	A layer of a material is created in a thin-film structure by coating a substrate 14 in one pass with an ink having a major, fugitive component 13 and at least one minor, non-fugitive component 12 and treating the ink to expel the major component 13 to leave the layer 15 of material. The layer 15 may be an electrically insulating layer having a thickness in the range 0.5 to 10 micrometres, with the ink containing non-fugitive colloidal ceramic nanoparticles having a size in the range 10 to 100 nanometres. The layer 15 may be a process control layer, such as an etch stop layer or barrier layer. The layer 15 may be an optically emissive layer or a layer of predetermined electrical conductivity.