System for protecting an electronic circuit on a vehicle structure

A system for protecting an electronic circuit (103a) on a vehicle structure from damage caused by electromagnetic charge comprises a substrate, the bottom portion of which is connected to the vehicle structure and the top portion being an electronic circuit. A package substrate (111) having a plurality of layers is operatively connected to the top portion and conforms to a peripheral area of the top portion. Operative connection may be by means of a sealant, such as a liquid adhesive. An internal dessicant film such as silica may be bonded to a bottom layer of the package substrate. The package substrate may comprise a bottom inner insulating layer which may be an electrostatic discharge film such as PET, PEN, polyethylene or polyimide, a middle layer such as a nickel or tin plated copper film or aluminium, and an outer layer which may be puncture and abrasion resistant such as PET, Tyvek (RTM) or Teflon (RTM).