System and method for soldering surface mount components to a substrate using a laser

The present invention relates to systems and methods for mounting electronic components 24 to flexible substrates 12 using laser light 17, wherein the flexible substrates 12 have a low glass transition temperature. A method for reflowing a solder 26 dispersed between a plurality electrical circuit c...

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Bibliographische Detailangaben
Hauptverfasser:	ZHONG-YOU(JOE) SHI, JAY D BAKER, PETER JOSEPH SINKUNAS
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CURRENT COLLECTORS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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