System and method for soldering surface mount components to a substrate using a laser

The present invention relates to systems and methods for mounting electronic components 24 to flexible substrates 12 using laser light 17, wherein the flexible substrates 12 have a low glass transition temperature. A method for reflowing a solder 26 dispersed between a plurality electrical circuit conductor pads 28 attached to the flexible substrate 12 and at least one electronic component 24 using a laser is disclosed. The method includes aligning the plurality of electric circuit conductor pads 28 along a common axis, placing the at least one electronic component 24 having a light coloured surface side on a pair of the electrical circuit conductor pads 28 wherein the light coloured surface faces the laser, and sweeping the laser across the electronic component(s) 24 and conductor pads 28 to reflow the solder without damaging the substrate 12.