System and method for soldering surface mount components to a substrate using a laser
The present invention relates to systems and methods for mounting electronic components 24 to flexible substrates 12 using laser light 17, wherein the flexible substrates 12 have a low glass transition temperature. A method for reflowing a solder 26 dispersed between a plurality electrical circuit c...
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| creator | ZHONG-YOU(JOE) SHI JAY D BAKER PETER JOSEPH SINKUNAS |
| description | The present invention relates to systems and methods for mounting electronic components 24 to flexible substrates 12 using laser light 17, wherein the flexible substrates 12 have a low glass transition temperature. A method for reflowing a solder 26 dispersed between a plurality electrical circuit conductor pads 28 attached to the flexible substrate 12 and at least one electronic component 24 using a laser is disclosed. The method includes aligning the plurality of electric circuit conductor pads 28 along a common axis, placing the at least one electronic component 24 having a light coloured surface side on a pair of the electrical circuit conductor pads 28 wherein the light coloured surface faces the laser, and sweeping the laser across the electronic component(s) 24 and conductor pads 28 to reflow the solder without damaging the substrate 12. |
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A method for reflowing a solder 26 dispersed between a plurality electrical circuit conductor pads 28 attached to the flexible substrate 12 and at least one electronic component 24 using a laser is disclosed. The method includes aligning the plurality of electric circuit conductor pads 28 along a common axis, placing the at least one electronic component 24 having a light coloured surface side on a pair of the electrical circuit conductor pads 28 wherein the light coloured surface faces the laser, and sweeping the laser across the electronic component(s) 24 and conductor pads 28 to reflow the solder without damaging the substrate 12.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CURRENT COLLECTORS ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINE CONNECTORS ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030910&DB=EPODOC&CC=GB&NR=2386251A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030910&DB=EPODOC&CC=GB&NR=2386251A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHONG-YOU(JOE) SHI</creatorcontrib><creatorcontrib>JAY D BAKER</creatorcontrib><creatorcontrib>PETER JOSEPH SINKUNAS</creatorcontrib><title>System and method for soldering surface mount components to a substrate using a laser</title><description>The present invention relates to systems and methods for mounting electronic components 24 to flexible substrates 12 using laser light 17, wherein the flexible substrates 12 have a low glass transition temperature. A method for reflowing a solder 26 dispersed between a plurality electrical circuit conductor pads 28 attached to the flexible substrate 12 and at least one electronic component 24 using a laser is disclosed. The method includes aligning the plurality of electric circuit conductor pads 28 along a common axis, placing the at least one electronic component 24 having a light coloured surface side on a pair of the electrical circuit conductor pads 28 wherein the light coloured surface faces the laser, and sweeping the laser across the electronic component(s) 24 and conductor pads 28 to reflow the solder without damaging the substrate 12.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CURRENT COLLECTORS</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqFjLsOwjAMALMwIOAb8A8w0ArECojHDsyVaRxASuwodgb-niKxM91wpxu72-WtRgmQPSSyp3gIUkAleiovfoDWErAnSFLZoJeUhYlNwQRwsHe1gkZQ9VsjRFQqUzcKGJVmP07c_Hi47s8LytKR5mHIZN1p17SbdbNabtv_xQcMuzhm</recordid><startdate>20030910</startdate><enddate>20030910</enddate><creator>ZHONG-YOU(JOE) SHI</creator><creator>JAY D BAKER</creator><creator>PETER JOSEPH SINKUNAS</creator><scope>EVB</scope></search><sort><creationdate>20030910</creationdate><title>System and method for soldering surface mount components to a substrate using a laser</title><author>ZHONG-YOU(JOE) SHI ; JAY D BAKER ; PETER JOSEPH SINKUNAS</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_GB2386251A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CURRENT COLLECTORS</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHONG-YOU(JOE) SHI</creatorcontrib><creatorcontrib>JAY D BAKER</creatorcontrib><creatorcontrib>PETER JOSEPH SINKUNAS</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHONG-YOU(JOE) SHI</au><au>JAY D BAKER</au><au>PETER JOSEPH SINKUNAS</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>System and method for soldering surface mount components to a substrate using a laser</title><date>2003-09-10</date><risdate>2003</risdate><abstract>The present invention relates to systems and methods for mounting electronic components 24 to flexible substrates 12 using laser light 17, wherein the flexible substrates 12 have a low glass transition temperature. A method for reflowing a solder 26 dispersed between a plurality electrical circuit conductor pads 28 attached to the flexible substrate 12 and at least one electronic component 24 using a laser is disclosed. The method includes aligning the plurality of electric circuit conductor pads 28 along a common axis, placing the at least one electronic component 24 having a light coloured surface side on a pair of the electrical circuit conductor pads 28 wherein the light coloured surface faces the laser, and sweeping the laser across the electronic component(s) 24 and conductor pads 28 to reflow the solder without damaging the substrate 12.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CURRENT COLLECTORS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | System and method for soldering surface mount components to a substrate using a laser |
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