Repairable flexible circuit

A flexible circuit 50, 52 can be repaired by cutting out a failed portion of the circuit and electrically interconnecting the remaining portions using a repair patch 40. The connection may be made using a solder preform 38 which can be melted, for example, using diode lasers. The flexible substrate...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: STEPHEN EDWARD FUKS, ROBERT EDWARD BELKE, CHARLES FREDERICK SCHWEITZER, RAYMOND ERIC FOSTER
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A flexible circuit 50, 52 can be repaired by cutting out a failed portion of the circuit and electrically interconnecting the remaining portions using a repair patch 40. The connection may be made using a solder preform 38 which can be melted, for example, using diode lasers. The flexible substrate may have a alignment apertures 35 to facilitate alignment of the two portions to be joined.