Headset with adjustable earpiece

A headset has an earpiece and a flexible microphone boom. The headset is designed and constructed to be lightweight, flexibly adjustable, and comfortable to wear. The earpiece fits comfortably over an external portion of an ear of a wearer and between a head of the wearer and the ear. The earpiece is designed to be easily adjusted for a secure, comfortable fit. In the preferred embodiment, the earpiece includes a rigid plastic backbone and a ductile wire. In an alternate embodiment, the earpiece includes a rigid plastic backbone, a spring, and a ductile wire. The earpiece has an asymmetrical U shape, facilitating easy adjustment to fit securely around the external portion of the ear. A speaker module is coupled to the earpiece and designed to rest over a pinna of the ear when the earpiece is worn over the ear. A small speaker is mounted inside the speaker module. The speaker module is coupled to the earpiece by a ball and socket joint integrally formed as part of the earpiece. A speaker cushion is configured to fit over the speaker module and has a lip which fits within a groove of the speaker module. The speaker cushion is compressible to facilitate stably positioning the speaker module against the pinna.