Mounting chips on substrates

A method of mounting a chip 105 on a substrate 101 provided with gold pads 201 comprises applying a protective paste over the pads, the paste consisting of a solution of a citrate salt dissolved in water with the addition of glycerol. After mounting, soldering and adhesively securing the chip to the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MICHELE MONOPOLI, VITTORIO SIRTORI, LUIGI GIUSSANI, LORENZA LOMBARDI, FRANCO ZAMBON
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A method of mounting a chip 105 on a substrate 101 provided with gold pads 201 comprises applying a protective paste over the pads, the paste consisting of a solution of a citrate salt dissolved in water with the addition of glycerol. After mounting, soldering and adhesively securing the chip to the substrate, the protective paste is washed away followed by UV cleaning and wire bonding.