Attachment device for a cryogenic satellite tank

Attachment device for a cryogenic satellite tank

The present invention relates to an attachment device for a cryogenic satellite tank. In order to achieve adequate rigidity in such an attachment device while reducing the thermal conductivity and at the same time ensuring simple construction which is easy to realize from a technical point of view,...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHRISTIAN SCHLOSSER, HEINZ VOGGENREITER, JOACHIM SCHUPP, AXEL RUNGE, ANDREAS SCHUSTER
Format: Patent
Sprache:eng
Schlagworte:
AIRCRAFT
AVIATION
BLASTING
COSMONAUTICS
DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS ORMACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS,CLIPS, WEDGES, JOINTS OR JOINTING
ENGINEERING ELEMENTS AND UNITS
GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS
HEATING
LIGHTING
MECHANICAL ENGINEERING
PERFORMING OPERATIONS
THERMAL INSULATION IN GENERAL
TRANSPORTING
VEHICLES OR EQUIPMENT THEREFOR
WEAPONS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present invention relates to an attachment device for a cryogenic satellite tank. In order to achieve adequate rigidity in such an attachment device while reducing the thermal conductivity and at the same time ensuring simple construction which is easy to realize from a technical point of view, so-called shape memory alloy elements are used. Due to suitable arrangement or interaction between a support element (1) and a connecting component (2) or a thermally controlled connection arranged in the support element (1) it is achieved that after the launch of the rocket, the SMA element automatically expands significantly in the cold space environment as a result of phase transformation, thus reducing surface pressure at respective connection points of the attachment device, and partly disengaging the contact. Consequently, the thermal flow via these connection points is reduced or completely eliminated.