Structural part for HF-tight housings

For the purpose of high frequency effective insulation for gaps in the enclosure of electronic devices, a plate 1 is proposed that shows a groove 9 on at least one of its narrow sides 7, 8. In this groove 9 is a spring element 2 with its attached leaf clip 12. Attached on the leaf clip 12 is a right...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MICHAEL JOIST, HANS-ULRICH GUNTHER, KLAUS PFEIFER
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:For the purpose of high frequency effective insulation for gaps in the enclosure of electronic devices, a plate 1 is proposed that shows a groove 9 on at least one of its narrow sides 7, 8. In this groove 9 is a spring element 2 with its attached leaf clip 12. Attached on the leaf clip 12 is a right-angled leaf spring 13, with a base piece 21 and a contact piece 22. The contact piece 22 is bent back on itself and bears a contact fin 29, which makes contact with the corresponding contact piece of a neighboring prefabricated component.