Microcooling device for electronic components and method for the production thereof

A microcooling device and a method for its manufacture. The microcooling device has a high heat conductivity, is designed to accommodate electronic components on its exterior surface, and has a channel structure in its interior through which a coolant fluid can flow to carry heat away from the compo...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	WOLFRAM MUNCH, HANS-JURGEN FUSSER, REINHARD ZACHAI, TIM GUTHEIT
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESISTORS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A microcooling device and a method for its manufacture. The microcooling device has a high heat conductivity, is designed to accommodate electronic components on its exterior surface, and has a channel structure in its interior through which a coolant fluid can flow to carry heat away from the components. The channel structure is formed by a base substrate provided with a plurality of recesses and a cover layer externally covering the recesses, the cover layer being made from an electrically insulating and heat-conducting material, and being such that the electronic components can be mounted directly thereon.