PHOTOSENSITIVE MATERIALS AND THEIR USE IN PREPARING PRINTED CIRCUITS

A photosensitive material comprising a releasable film layer 1, or photosensitive resin layer 2 and a polyimide precursor resin layer 3. The material, via the polyimide precursor resin layer, may be laminated onto an insulating board having an exposed circuit; followed by selectively exposing the ph...

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Bibliographische Detailangaben
Hauptverfasser:	ISAMU TAKARABE, HIROYUKI CHINJU, KAORU OKAMOTO, KEIJI YOSHIZAWA, HISASHI WATANABE, TAKASHI TANAKA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	A photosensitive material comprising a releasable film layer 1, or photosensitive resin layer 2 and a polyimide precursor resin layer 3. The material, via the polyimide precursor resin layer, may be laminated onto an insulating board having an exposed circuit; followed by selectively exposing the photosensitive resin layer to active light; developing the resultant photosensitive resin layer; removing the release layer and etching the exposed polyimide precursor resin layer with an alkaline solution using the photosensitive resin layer as a mask; removing the remaining photosensitive resin layer; and then curing the residual polyimide precursor resin layer to produce a printed circuit. The photosensitive material can provide an insulating protective layer for printed circuits having a high processing precision and excellent reliability in insulation.