Dipping apparatus

A dipping apparatus which can automatically dip miniature components, such as chip type electronic components, for forming electrodes thereon and which incorporates a supplying/discharging mechanism, take-in and take-out conveyors (5, 6) are provided on horizontal sides of a chucking mechanism (10), which is adapted to chuck a workpiece and vertically move the same, to be flush with each other for supplying and discharging the workpiece to and from a position of the chucking mechanism. A dipping vessel (7) is provided immediately under the chucking mechanism in a position lower than the level for carrying the workpiece by the take-in and take-out conveyors. The take-in and take-out conveyors, which are adapted to carry the workpiece in the same direction and at the same speed, are slid/driven in approaching and separating directions between standby positions which are opposite to each other through a vertical space of the chucking mechanism working positions which are located immediately under the chucking mechanism to be approximate to each other. Thus, it is possible to perform dipping in high accuracy without sliding the chucking portion while protecting the workpiece against vibration and deviation.