Printed wiring board

A printed wiring board has a substrate having an outer peripheral edge. A printed circuit is formed on at least one side of the substrate. A shock-absorbing band formed of copper foil is disposed along at least a portion of the outer peripheral edge of at least one side of the substrate and is effec...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SATOSHI HARUYAMA, HIROTAKA OKONOGI, SHIN KAWAKAMI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A printed wiring board has a substrate having an outer peripheral edge. A printed circuit is formed on at least one side of the substrate. A shock-absorbing band formed of copper foil is disposed along at least a portion of the outer peripheral edge of at least one side of the substrate and is effective to absorb at least some of the impact applied to the printed wiring board during cutting thereof.