Improvements in materials

A boron trioxide material having a softening point of less than 350 DEG C and a rate of softening exceeding 100 mu m/m/ DEG C above 360 DEG C is especially suitable as an encapsulant for semiconductor crystal drawing.

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Bibliographische Detailangaben
1. Verfasser: RODERICK GORDON LESTER BARNES
Format: Patent
Sprache:eng
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Zusammenfassung:A boron trioxide material having a softening point of less than 350 DEG C and a rate of softening exceeding 100 mu m/m/ DEG C above 360 DEG C is especially suitable as an encapsulant for semiconductor crystal drawing.