Improvements in materials
A boron trioxide material having a softening point of less than 350 DEG C and a rate of softening exceeding 100 mu m/m/ DEG C above 360 DEG C is especially suitable as an encapsulant for semiconductor crystal drawing.
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A boron trioxide material having a softening point of less than 350 DEG C and a rate of softening exceeding 100 mu m/m/ DEG C above 360 DEG C is especially suitable as an encapsulant for semiconductor crystal drawing. |
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