Resin-sealed semiconductor device

The semiconductor device comprises a semiconductor element 4, a lead 8, and a wire 7 electrically connecting the semiconductor element and the lead. The semiconductor element, the wire, and a portion of the lead are sealed in resin 9. Corrosion inhibitor selected from the group consisting of lead ox...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MATSUNAGA YOSHIHIRO, KIYOAKI TSUMURA, TADAO NISHIMORI, KOZO SHIMAMOTO, HIROMASA MATSUOKA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The semiconductor device comprises a semiconductor element 4, a lead 8, and a wire 7 electrically connecting the semiconductor element and the lead. The semiconductor element, the wire, and a portion of the lead are sealed in resin 9. Corrosion inhibitor selected from the group consisting of lead oxide, calcium hydroxide and zinc oxide is added into the sealing resin. Corrosion of the copper wire is supressed even in high temperature environments.