Epoxy foams

Rigid foams are produced by reacting at an ambient temperature within the range 50 DEG C to 80 DEG C a mixture which includes the following constituents:- (a) a liquid epoxy compound derived from a diglycidyl ether of bisphenol A or from N-glycidylamine, the epoxy equivalent weight of said compound...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ANNETTE LYNDA LEWIS, AGATHANGELOS HAJIMICHAEL, AVERIL MYVANWY HORTON, CLIVE GORDON SIMMONDS
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Rigid foams are produced by reacting at an ambient temperature within the range 50 DEG C to 80 DEG C a mixture which includes the following constituents:- (a) a liquid epoxy compound derived from a diglycidyl ether of bisphenol A or from N-glycidylamine, the epoxy equivalent weight of said compound lying between 100 and 300; (b) a carboxylic acid anhydride curing agent selected from methyl nadic anhydride, nadic anhydride, camphoric anhydride, phthalic anhydride and polyhydrophthalic anhydrides, (c) a foaming agent, (d) a tertiary amine, and (e) an aliphatic polymercaptan hydroxy compound. The foams remain stable and rigid at temperatures from 100 DEG C to 140 DEG C, are non-friable and non-brittle, and will withstand severe conditions of compression or impact.