Method of placing an article

A method of mounting electronic components (c) at predetermined positions on a printed circuit board and which is capable of simultaneously correcting the misregistration of a plurality of electronic components by one cycle of operations. Misregistration of individual electronic components with resp...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SHIGERU KUBOTA, SHOJI KANOU, MASAHIRO KUBO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A method of mounting electronic components (c) at predetermined positions on a printed circuit board and which is capable of simultaneously correcting the misregistration of a plurality of electronic components by one cycle of operations. Misregistration of individual electronic components with respect to suction tubes (3) of a suction head (2) is corrected immediately after the suction tubes (3) have sucked up the electronic components (c) from the cavities (1) of a jig in which the electronic components are charged to thereby place each of the suction tubes (3) at a predetermined or exact suction position on the electronic component. After the components have been sucked up the tubes are moved in both the x and y directions to cause impact of the mis-positioned components with the walls of the cavities and thus cause them to be correctly positioned by relative movement between the components and the tubes.