Electroplating indium on palladium substrate

A palladium substrate has deposited thereon a layer which consists of four sublayers, starting from the substrate: (a) a solid solution of indium in palladium, (b) Pd3In, (c) Pd2In and (d) beta -PdIn. The thickness of the external layer beta -PdIn constitutes 50-90% of the total thickness of the coa...

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Hauptverfasser:	NIKOLAI IVANOVICH TIMOFEEV, TATYANA LEONIDOVNA MITROFANOVA, ALEXANDR IVANOVICH ANFINOGENOV, NIKOLAI GRIGORIEVICH ILJUSCHENKO, JURY LEONIDOVICH ZARAPIN, NIKOLAI IVANOVICH SHUROV, ALBERT ALEXANDROVICH KURANOV, EVGENY VIKTOROVICH PALGUEV, LARISA IVANOVNA SJUTKINA, BORIS PETROVICH STARTSEV
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	A palladium substrate has deposited thereon a layer which consists of four sublayers, starting from the substrate: (a) a solid solution of indium in palladium, (b) Pd3In, (c) Pd2In and (d) beta -PdIn. The thickness of the external layer beta -PdIn constitutes 50-90% of the total thickness of the coating layer, and the thickness of other sublayers of the coating layer correspondingly constitutes from 50% to 10% of the total thickness thereof. The layer is deposited by electroplating from a molten salt bath containing indium values.