FOUR-MOTION WIRE BONDER

A four-motion wire bonding apparatus, for effecting wire bonds between a semiconductor chip and a lead frame. In addition to employing X-, Y-, Z- and theta-motion drives for the bonding head, the apparatus provides a bulk wire-feed, which delivers bonding wire along the theta-rotation axis.

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Bibliographische Detailangaben
Hauptverfasser:	LO KWAN CHAN, YUI KIN TANG, JUI CHANG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CURRENT COLLECTORS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A four-motion wire bonding apparatus, for effecting wire bonds between a semiconductor chip and a lead frame. In addition to employing X-, Y-, Z- and theta-motion drives for the bonding head, the apparatus provides a bulk wire-feed, which delivers bonding wire along the theta-rotation axis.