SUB-ELEMENT FOR ELECTRONIC CIRCUIT BOARD

1,269,592. Printed circuits. N. R. LEVESQUE, and D. E. HARPER. 4 Feb., 1970 [24 Feb., 1969], No. 5339/70. Heading H1R. A sub-element for making electronic circuit boards comprises an epoxy glass substrate carrying copper clad areas on one side and a pressure-sensitive adhesive on the other. The copp...

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Bibliographische Detailangaben
Hauptverfasser:	DONALD EARL HARPER, NORMAN RUSSEL LEVESQUE
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Zusammenfassung:	1,269,592. Printed circuits. N. R. LEVESQUE, and D. E. HARPER. 4 Feb., 1970 [24 Feb., 1969], No. 5339/70. Heading H1R. A sub-element for making electronic circuit boards comprises an epoxy glass substrate carrying copper clad areas on one side and a pressure-sensitive adhesive on the other. The copper clad areas may be in the form of a printed circuit or a mounting pattern for at least one electrical component. To make a circuit board, a plurality of sub-elements are mounted on an insulating board, connections between the subelements being made by conventional wiring or by electrically conductive tape.