Improvements in and relating to the electrodeposition of palladium

Palladium plating baths include an ammonium salt of a weak organic acid soluble in the neutral or alkaline bath e.g. ammonium citrate, oxalate, formate, acetate or of E.D.T.A. Palladium diammino-di-nitrite, or the tetra-ammino-nitrate are specified, but the acetate and chloride are also referred to....

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Hauptverfasser: HILL JOHN, HEATHCOTE LAURENCE ALFRED
Format: Patent
Sprache:eng
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Zusammenfassung:Palladium plating baths include an ammonium salt of a weak organic acid soluble in the neutral or alkaline bath e.g. ammonium citrate, oxalate, formate, acetate or of E.D.T.A. Palladium diammino-di-nitrite, or the tetra-ammino-nitrate are specified, but the acetate and chloride are also referred to. Examples are given using each of the specified ammonium salts, in which the pH is 8 to 9, and temperature is 15 to 75 DEG C. The electrolyte should be free of cyanide ions. Base metals plated are, copper, bronze, brass, beryllium-copper, stainless or mild steel, silver or nickel. Tables are given of detailed process conditions and results.