COMPOSITION RETICULABLE DE POLYMERE A TERMINAISON SILYL ET procédé d'assemblage de substrats LA METTANT EN OEUVRE
1) Composition adhésive réticulable comprenant : - au moins un polymère (A) comprenant un groupe alkoxysilane hydrolysable ; - au moins une résine tackifiante (B) ; - au moins une silice pyrogénée (C), de préférence hydrophobe; et - au moins un catalyseur de réticulation (D). 2) Utilisation de ladit...
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| creator | LALOUCH, Lahoussaine BORDAT, Jean-Marie MAMERI, Foudil |
| description | 1) Composition adhésive réticulable comprenant : - au moins un polymère (A) comprenant un groupe alkoxysilane hydrolysable ; - au moins une résine tackifiante (B) ; - au moins une silice pyrogénée (C), de préférence hydrophobe; et - au moins un catalyseur de réticulation (D). 2) Utilisation de ladite composition pour l'assemblage semi-structural de deux substrats. 3) Procédé d'assemblage de 2 substrats comprenant : - la fusion de ladite composition par chauffage à une température de 30 à 130°C, puis - sa dépose sur une surface d'un premier substrat, puis - sa réticulation par chauffage à une température de 15 à 200°C et la mise en contact de ladite surface avec une surface d'un second substrat.
The invention relates to: (1) A cross-linkable adhesive composition comprising: - at least one polymer (A) comprising a hydrolysable alkoxysilane group; - at least one tackifying resin (B); - at least one fumed silica (C), preferably hydrophobic; - at least one cross-linking catalyst (D); and - a silsesquioxane resin (E). (2) The use of said composition for semi-structural joining of two substrates. (3) A method for joining two substrates, which comprises: - melting said composition by heating to a temperature of from 30 to 130°C, then - depositing said composition on a surface of a first substrate, and then - cross-linking said composition by heating to a temperature of from 15 to 200°C and placing said surface in contact with a surface of a second substrate. |
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The invention relates to: (1) A cross-linkable adhesive composition comprising: - at least one polymer (A) comprising a hydrolysable alkoxysilane group; - at least one tackifying resin (B); - at least one fumed silica (C), preferably hydrophobic; - at least one cross-linking catalyst (D); and - a silsesquioxane resin (E). (2) The use of said composition for semi-structural joining of two substrates. (3) A method for joining two substrates, which comprises: - melting said composition by heating to a temperature of from 30 to 130°C, then - depositing said composition on a surface of a first substrate, and then - cross-linking said composition by heating to a temperature of from 15 to 200°C and placing said surface in contact with a surface of a second substrate.</description><language>fre</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; DYES ; GENERAL PROCESSES OF COMPOUNDING ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; USE OF MATERIALS AS ADHESIVES ; WORKING-UP</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241101&DB=EPODOC&CC=FR&NR=3125053B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25566,76549</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241101&DB=EPODOC&CC=FR&NR=3125053B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LALOUCH, Lahoussaine</creatorcontrib><creatorcontrib>BORDAT, Jean-Marie</creatorcontrib><creatorcontrib>MAMERI, Foudil</creatorcontrib><title>COMPOSITION RETICULABLE DE POLYMERE A TERMINAISON SILYL ET procédé d'assemblage de substrats LA METTANT EN OEUVRE</title><description>1) Composition adhésive réticulable comprenant : - au moins un polymère (A) comprenant un groupe alkoxysilane hydrolysable ; - au moins une résine tackifiante (B) ; - au moins une silice pyrogénée (C), de préférence hydrophobe; et - au moins un catalyseur de réticulation (D). 2) Utilisation de ladite composition pour l'assemblage semi-structural de deux substrats. 3) Procédé d'assemblage de 2 substrats comprenant : - la fusion de ladite composition par chauffage à une température de 30 à 130°C, puis - sa dépose sur une surface d'un premier substrat, puis - sa réticulation par chauffage à une température de 15 à 200°C et la mise en contact de ladite surface avec une surface d'un second substrat.
The invention relates to: (1) A cross-linkable adhesive composition comprising: - at least one polymer (A) comprising a hydrolysable alkoxysilane group; - at least one tackifying resin (B); - at least one fumed silica (C), preferably hydrophobic; - at least one cross-linking catalyst (D); and - a silsesquioxane resin (E). (2) The use of said composition for semi-structural joining of two substrates. (3) A method for joining two substrates, which comprises: - melting said composition by heating to a temperature of from 30 to 130°C, then - depositing said composition on a surface of a first substrate, and then - cross-linking said composition by heating to a temperature of from 15 to 200°C and placing said surface in contact with a surface of a second substrate.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>DYES</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyj0OgjAUAGAWB6Pe4W1OJiLhAAUfsUl_SKkmTKRAdUEhPDwU5-BiOngAp2_51gGlWua64JZrBQYtT6-CJQLhjJBrUUo0CAwsGskV48V3FVyUAtDCMPbNMrfLDO3eEfln3bmHh9YDvWuaRjcRCAYSrWXKAirQeL0Z3Aaru-vI735uAsjQppeDH_rK0-Aa__JTlZkoPMXHOErC6I_yAaaaPUw</recordid><startdate>20241101</startdate><enddate>20241101</enddate><creator>LALOUCH, Lahoussaine</creator><creator>BORDAT, Jean-Marie</creator><creator>MAMERI, Foudil</creator><scope>EVB</scope></search><sort><creationdate>20241101</creationdate><title>COMPOSITION RETICULABLE DE POLYMERE A TERMINAISON SILYL ET procédé d'assemblage de substrats LA METTANT EN OEUVRE</title><author>LALOUCH, Lahoussaine ; BORDAT, Jean-Marie ; MAMERI, Foudil</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_FR3125053B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>fre</language><creationdate>2024</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>DYES</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>LALOUCH, Lahoussaine</creatorcontrib><creatorcontrib>BORDAT, Jean-Marie</creatorcontrib><creatorcontrib>MAMERI, Foudil</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LALOUCH, Lahoussaine</au><au>BORDAT, Jean-Marie</au><au>MAMERI, Foudil</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COMPOSITION RETICULABLE DE POLYMERE A TERMINAISON SILYL ET procédé d'assemblage de substrats LA METTANT EN OEUVRE</title><date>2024-11-01</date><risdate>2024</risdate><abstract>1) Composition adhésive réticulable comprenant : - au moins un polymère (A) comprenant un groupe alkoxysilane hydrolysable ; - au moins une résine tackifiante (B) ; - au moins une silice pyrogénée (C), de préférence hydrophobe; et - au moins un catalyseur de réticulation (D). 2) Utilisation de ladite composition pour l'assemblage semi-structural de deux substrats. 3) Procédé d'assemblage de 2 substrats comprenant : - la fusion de ladite composition par chauffage à une température de 30 à 130°C, puis - sa dépose sur une surface d'un premier substrat, puis - sa réticulation par chauffage à une température de 15 à 200°C et la mise en contact de ladite surface avec une surface d'un second substrat.
The invention relates to: (1) A cross-linkable adhesive composition comprising: - at least one polymer (A) comprising a hydrolysable alkoxysilane group; - at least one tackifying resin (B); - at least one fumed silica (C), preferably hydrophobic; - at least one cross-linking catalyst (D); and - a silsesquioxane resin (E). (2) The use of said composition for semi-structural joining of two substrates. (3) A method for joining two substrates, which comprises: - melting said composition by heating to a temperature of from 30 to 130°C, then - depositing said composition on a surface of a first substrate, and then - cross-linking said composition by heating to a temperature of from 15 to 200°C and placing said surface in contact with a surface of a second substrate.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON DYES GENERAL PROCESSES OF COMPOUNDING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES WORKING-UP |
| title | COMPOSITION RETICULABLE DE POLYMERE A TERMINAISON SILYL ET procédé d'assemblage de substrats LA METTANT EN OEUVRE |
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