CIRCUIT INTEGRE ET PROCEDE DE FABRICATION D'UN CIRCUIT EQUIPE D'UNE SONDE DE TEMPERATURE
The circuit (2) has a first electrical conductor (14) insulated from a substrate (6), and a second electrical conductor (18) electrically insulated from the first conductor except at distal end (62). The end is directly in contact with a distal end (42) of the first conductor to form an electric jun...
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| creator | CHERAMY SEVERINE |
| description | The circuit (2) has a first electrical conductor (14) insulated from a substrate (6), and a second electrical conductor (18) electrically insulated from the first conductor except at distal end (62). The end is directly in contact with a distal end (42) of the first conductor to form an electric junction (63). The ends are entirely buried to 5 micrometers deep inside the substrate and produced in different materials to achieve a seeback coefficient of junction having an absolute value greater than 1 microvolts per Kelvin at 20 degrees Celsius. The conductors form a temperature probe. An independent claim is also included for a method for fabricating an integrated circuit equipped with a temperature probe. |
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The end is directly in contact with a distal end (42) of the first conductor to form an electric junction (63). The ends are entirely buried to 5 micrometers deep inside the substrate and produced in different materials to achieve a seeback coefficient of junction having an absolute value greater than 1 microvolts per Kelvin at 20 degrees Celsius. The conductors form a temperature probe. 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The end is directly in contact with a distal end (42) of the first conductor to form an electric junction (63). The ends are entirely buried to 5 micrometers deep inside the substrate and produced in different materials to achieve a seeback coefficient of junction having an absolute value greater than 1 microvolts per Kelvin at 20 degrees Celsius. The conductors form a temperature probe. An independent claim is also included for a method for fabricating an integrated circuit equipped with a temperature probe.</description><subject>ELECTRICITY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIhw9gxyDvUMUfD0C3F1D3JVcA1RCAjyd3Z1cVUAIjdHpyBPZ8cQT38_BRf1UD8FmHLXwFDPAFewmKtCsL8fRHmIq2-Aa5BjSGiQKw8Da1piTnEqL5TmZlBwcw1x9tBNLciPTy0uSExOzUstiXcLMjYwMABiJ0NjIpQAAEf7MC8</recordid><startdate>20150227</startdate><enddate>20150227</enddate><creator>CHERAMY SEVERINE</creator><scope>EVB</scope></search><sort><creationdate>20150227</creationdate><title>CIRCUIT INTEGRE ET PROCEDE DE FABRICATION D'UN CIRCUIT EQUIPE D'UNE SONDE DE TEMPERATURE</title><author>CHERAMY SEVERINE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_FR3000300B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>fre</language><creationdate>2015</creationdate><topic>ELECTRICITY</topic><toplevel>online_resources</toplevel><creatorcontrib>CHERAMY SEVERINE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHERAMY SEVERINE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CIRCUIT INTEGRE ET PROCEDE DE FABRICATION D'UN CIRCUIT EQUIPE D'UNE SONDE DE TEMPERATURE</title><date>2015-02-27</date><risdate>2015</risdate><abstract>The circuit (2) has a first electrical conductor (14) insulated from a substrate (6), and a second electrical conductor (18) electrically insulated from the first conductor except at distal end (62). The end is directly in contact with a distal end (42) of the first conductor to form an electric junction (63). The ends are entirely buried to 5 micrometers deep inside the substrate and produced in different materials to achieve a seeback coefficient of junction having an absolute value greater than 1 microvolts per Kelvin at 20 degrees Celsius. The conductors form a temperature probe. An independent claim is also included for a method for fabricating an integrated circuit equipped with a temperature probe.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ELECTRICITY |
| title | CIRCUIT INTEGRE ET PROCEDE DE FABRICATION D'UN CIRCUIT EQUIPE D'UNE SONDE DE TEMPERATURE |
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