CIRCUIT INTEGRE ET PROCEDE DE FABRICATION D'UN CIRCUIT EQUIPE D'UNE SONDE DE TEMPERATURE

The circuit (2) has a first electrical conductor (14) insulated from a substrate (6), and a second electrical conductor (18) electrically insulated from the first conductor except at distal end (62). The end is directly in contact with a distal end (42) of the first conductor to form an electric jun...

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1. Verfasser: CHERAMY SEVERINE
Format: Patent
Sprache:fre
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Zusammenfassung:The circuit (2) has a first electrical conductor (14) insulated from a substrate (6), and a second electrical conductor (18) electrically insulated from the first conductor except at distal end (62). The end is directly in contact with a distal end (42) of the first conductor to form an electric junction (63). The ends are entirely buried to 5 micrometers deep inside the substrate and produced in different materials to achieve a seeback coefficient of junction having an absolute value greater than 1 microvolts per Kelvin at 20 degrees Celsius. The conductors form a temperature probe. An independent claim is also included for a method for fabricating an integrated circuit equipped with a temperature probe.