STRUCTURE DE BOITIER EMPILEE TRIDIMENSIONNELLE ET PROCEDE DE FABRICATION DE CELLE-CI

A 3D stacked package structure includes a first unit, a molding unit, a conductive unit and a second unit. The first unit includes a first substrate and at least one first electronic component, and the first substrate has at least one runner and at least one first conductive pad. The molding unit includes a top portion, a frame, and at least one connection connected between the top portion and the frame. The conductive unit includes at least one conductor passing through the frame and electrically connected to the first conductive pad. Therefore, the first unit can be stacked on the second unit through the frame of the molding unit, and the first unit can be electrically connected to the second unit through the conductor of the conductive unit.