Semiconductor device, has electrical connection of intermediate elements provided between support plate and chip and connected to electrical interconnection unit of plate and rear electrical interconnection network of chip

The device (1) has an electrical connection support plate (2), and an integrated circuit chip (8). A rear electrical interconnection network (13) is provided with a through-vias electrical connection (5) for connecting the rear electrical interconnection network with a front electrical interconnecti...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHAVADE JACQUES, MARAIS DOMINIQUE
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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