PROCEDE DE FABRICATION D'UNE UNITE ELECTRONIQUE ET L'UNITE ELECTRONIQUE OBTENUE

A method for producing an electronic module, in that at least one first microelectronic component is provided and is electrically connected to a second microelectronic component by a first flip-chip method step; at least one dielectric component is provided which has at least one printed circuit tra...

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Bibliographische Detailangaben
Hauptverfasser:	ZINOBER SVEN, SCHMIDT MANUELA, FRANKE AXEL
Format:	Patent
Sprache:	fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING RECORD CARRIERS MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICS PRESENTATION OF DATA PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES TRANSPORTING
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