PROCEDE DE FABRICATION D'UNE UNITE ELECTRONIQUE ET L'UNITE ELECTRONIQUE OBTENUE

PROCEDE DE FABRICATION D'UNE UNITE ELECTRONIQUE ET L'UNITE ELECTRONIQUE OBTENUE

A method for producing an electronic module, in that at least one first microelectronic component is provided and is electrically connected to a second microelectronic component by a first flip-chip method step; at least one dielectric component is provided which has at least one printed circuit tra...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ZINOBER SVEN, SCHMIDT MANUELA, FRANKE AXEL
Format: Patent
Sprache:fre
Schlagworte:
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING RECORD CARRIERS
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PHYSICS
PRESENTATION OF DATA
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
RECOGNITION OF DATA
RECORD CARRIERS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Beschreibung
Zusammenfassung:A method for producing an electronic module, in that at least one first microelectronic component is provided and is electrically connected to a second microelectronic component by a first flip-chip method step; at least one dielectric component is provided which has at least one printed circuit trace, and at least one printed circuit trace of the dielectric component is electrically connected to the second microelectronic component; and the second microelectronic component is electrically connected by a second flip-chip method step to a printed circuit board by way of the printed circuit trace(s) of the dielectric component, in order to avoid vias through a microelectronic component; the invention also relates to a corresponding electronic module.