Case and printed circuit card assembly for use in automobile field, has case for receiving printed circuit card, and resin in contact with lower surface of card, where thickness of resin is less than distance between case bottom and card

The assembly has a case (1) for receiving a printed circuit card (4). The case includes a maintenance unit formed by a stud (16) and a flange (17) to maintain the card at a distance from bottom (3) of the case. Distance (Dmax) between the bottom of the case and the card is measured along an axis per...

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Bibliographische Detailangaben
Hauptverfasser: TINGAUD STEPHANE, BRISSET ANTHONY, THIOLLAY LIONEL
Format: Patent
Sprache:eng ; fre
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Beschreibung
Zusammenfassung:The assembly has a case (1) for receiving a printed circuit card (4). The case includes a maintenance unit formed by a stud (16) and a flange (17) to maintain the card at a distance from bottom (3) of the case. Distance (Dmax) between the bottom of the case and the card is measured along an axis perpendicular to the card until bottom points of the case are separated from the card. Resin (8) is in contact with a lower surface of the card, where thickness of the resin is less than the distance (Dmax). Holes (9) are formed in the card for passage of the resin. Assemblage qui comporte un boîtier dans lequel est reçu un circuit imprimé notamment dit de puissance, le boîtier comportant des moyens destinés à maintenir le circuit imprimé (4) à distance du fond (3) du boîtier,caractérisé en ce qu'il est prévu de disposer entre la surface inférieure de la carte de puissance et le fond du boîtier des moyens (10, 11,12) pour dissiper la chaleur de la carte de puissance vers l'extérieur du boîtier.