Coating mass e.g. adhesive, applying method, involves applying glue components on glue zone using micro-metering valves, and applying thermo-conducting paste in intervals of glue points formed by mixing components

The method involves applying glue components (12, 14) on a glue zone (13) of a substrate constituting metering zone, with the help of micro-metering valves (6, 9) of a coating applying device (5). The components are mixed for forming glue points (4). A thermo-conducting paste is applied in intervals...

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Bibliographische Detailangaben
Hauptverfasser:	KOELLE GEHARD, HOLDER SIEGFRIED
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The method involves applying glue components (12, 14) on a glue zone (13) of a substrate constituting metering zone, with the help of micro-metering valves (6, 9) of a coating applying device (5). The components are mixed for forming glue points (4). A thermo-conducting paste is applied in intervals of the glue points with the help of the applying device. Independent claims are also included for the following: (A) a method of fabricating semi-conductor module (B) a device for applying a coating mass. Procédé et dispositif d'application d'une masse à plusieurs composants notamment d'un adhésif à deux composants ou d'une masse coulée à plusieurs composants sur le substrat (2) d'un module semi-conducteur (1).Sur le substrat (2) on applique avec au moins deux micro-soupapes de dosage (6, 9) d'un dispositif applicateur (5), différents composants (12, 14) de la masse de revêtement (4) sur une zone de dosage (13). L'application peut se faire séquentiellement par exemple avec des micro-soupapes de dosage (6, 9) alignées ou simultanément avec des micro-soupapes de dosage (6, 9) faisant entre elles un angle.On peut également appliquer en alternance plusieurs couches des deux composants (12, 14).