PORTE-PUCE DE SEMICONDUCTEUR A SYSTEME DE REFROIDISSEMENT ET RADIATEUR ADAPTE

Porte-puce à système de refroidissement, pouvant en particulier rapidement évacuer de la chaleur de la puce de semiconducteur, filtrer le bruit et réduire l'inductance pendant le fonctionnement. A semiconductor chip package with cooling arrangement includes a heat sink adapted for covering at least a semiconductor chip, characterized in that said heat sink has an inverted U-shaped cross section thereby forming a recess at an inner bottom thereof adapted for covering at least a semiconductor chip and a plurality of pins extending downwardly from a circumferential lower edge of said heat sink, each of said pins being formed with a neck, an enlarged head, and an open slot separating said neck and said enlarged head into two portions, whereby the package can rapidly remove heat from the semiconductor chip, filter noise and reduce inductance.