Connection between semiconducting component and cooling body has inner and outer bottom surfaces in thermal contact when cooling body and component are joined together
The cooling body (20) has an inner wall (202) joined to an inner bottom surface and the semiconducting component (10) has a base (12) with an outer wall (122) joined to an outer bottom surface. The inner and outer bottom surfaces are brought into at least partial thermal contact when the cooling bod...
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| Format: | Patent |
| Sprache: | eng ; fre |
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| Zusammenfassung: | The cooling body (20) has an inner wall (202) joined to an inner bottom surface and the semiconducting component (10) has a base (12) with an outer wall (122) joined to an outer bottom surface. The inner and outer bottom surfaces are brought into at least partial thermal contact when the cooling body and semiconducting component are joined together. AN Independent claim is also included for the following: a semiconducting component for connection to a cooling body, a cooling body and a method of connecting a semiconducting component to a cooling body.
Liaison d'un composant semi-conducteur (10) à un radiateur (20), le radiateur (20) ayant une paroi intérieure (202) et le composant semi-conducteur (10) un socle (12) avec une paroi extérieure (122). Le socle (12) a une surface extérieure de fond (124) adjacente à la paroi extérieure (122) et le radiateur (20) a une surface intérieure (204) de fond adjacente à la paroi intérieure (202), de sorte que les surfaces extérieure (124) et intérieure (204) des fonds sont, au moins en partie, en contact thermique lorsque le composant semi-conducteur (10) est relié au radiateur (20). |
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