Encapsulating structure for image acquisition chip of charge-coupled device, for use in miniature diagnostic devices and digital cameras

The encapsulating module structure of a charge-coupled device (1) is implemented on the lower side of a transparent glass plate (12) in the form of a high-performance substrate circuit (121) which is assembled by soldering with an image acquisition chip (11), and by use of solder balls (13) mounted...

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Bibliographische Detailangaben

1. Verfasser:	SHIEH WEN LO
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PICTORIAL COMMUNICATION, e.g. TELEVISION PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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