Encapsulating structure for image acquisition chip of charge-coupled device, for use in miniature diagnostic devices and digital cameras

The encapsulating module structure of a charge-coupled device (1) is implemented on the lower side of a transparent glass plate (12) in the form of a high-performance substrate circuit (121) which is assembled by soldering with an image acquisition chip (11), and by use of solder balls (13) mounted on a printed circuit board (16) in a manner to obtain a combination of circuits. In a variant of encapsulating structure, a transparent adhesive or a special chemical compound is used to fill the space between the circuit (121) on the glass plate (12) and the image acquisition chip (11), so that the trajectory of image formation (P) traverses the glass plate and the transparent layer before impinging on the chip. In another variant, the glass plate on lower side is joined with the high-performance substrate having a central opening and whose lower side is in the form of appropriate circuit which is assembled by soldering with the image acquisition chip. In another variant, the high-performance substrate is joined with the glass plate which is accommodated in an upper cavity, and the image acquisition chip is mounted by soldering in a lower cavity. In another variant, a conductor is utilized for mounting on the printed circuit board. Une structure d'encapsulage pour une puce de r ealisation d'image à dispositif à couplage de charges emploie essentiellement une technologie de montage par bosses soud ees pour utiliser directement un verre transparent (12) comme substrat avec un circuit (121) pour l'encapsulage, ou emploie une technologie de montage par bosses soud ees pour la combinaison avec diff erents types de substrats, afin de r ealiser un module d'encapsulage de puce de r ealisation d'image à dispositif à couplage de charges du type mince (1), de façon à r eduire l' epaisseur du module d'encapsulage de puce de r ealisation d'image à dispositif à couplage de charges (1).