PROCEDE D'ASSEMBLAGE DE COMPOSANTS ELECTRONIQUES SUR UN SUPPORT ET DISPOSITIF ELECTRONIQUE OBTENU PAR CE PROCEDE

The invention concerns a method for assembling electronic components (4) with copper pins (2), on a support comprising a step which consists in soldering the pins (2) of each component (4) on the support, with a lead-free soldering material having a weight concentration in tin higher than 75 %. The...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MARTIN GERARD MARIE, HENRY KOUPAIA, LOPEZ ANABELLE, LE MEAU MICHEL
Format:	Patent
Sprache:	fre
Schlagworte:	ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!