Smart card with integrated circuit

The card has the integrated circuit chip (1) set into the thermoplastic material of the card when the plastic is heated. The lateral faces of the circuit chip are joined by chamfered or rounded angles (4). The chamfering or rounding of the edges of the circuit chip is formed while the chip is still...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: THEVENOT BENOIT, SIETTLER SOPHIE, LARCHEVESQUE ALAIN, LETOURNEL JEAN LUC
Format: Patent
Sprache:eng ; fre
Schlagworte:
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