Smart card with integrated circuit

The card has the integrated circuit chip (1) set into the thermoplastic material of the card when the plastic is heated. The lateral faces of the circuit chip are joined by chamfered or rounded angles (4). The chamfering or rounding of the edges of the circuit chip is formed while the chip is still part of a silicon wafer. The individual circuits are separated by a saw. The chamfering and rounding is implemented by an etching process, which is done before or after the chips are separated by sawing. Objet portatif équipé d'une pastille (1) de circuit intégré par enfoncement à chaud de cette pastille dans une masse (2) thermoplastique de l'objet, les faces latérales (1a) de la pastille étant reliées entre elles et/ou à la face active (3) de la pastille par des angles abattus ou arrondis (4, 13).