Smart card with integrated circuit
The card has the integrated circuit chip (1) set into the thermoplastic material of the card when the plastic is heated. The lateral faces of the circuit chip are joined by chamfered or rounded angles (4). The chamfering or rounding of the edges of the circuit chip is formed while the chip is still...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | THEVENOT BENOIT SIETTLER SOPHIE LARCHEVESQUE ALAIN LETOURNEL JEAN LUC |
| description | The card has the integrated circuit chip (1) set into the thermoplastic material of the card when the plastic is heated. The lateral faces of the circuit chip are joined by chamfered or rounded angles (4). The chamfering or rounding of the edges of the circuit chip is formed while the chip is still part of a silicon wafer. The individual circuits are separated by a saw. The chamfering and rounding is implemented by an etching process, which is done before or after the chips are separated by sawing.
Objet portatif équipé d'une pastille (1) de circuit intégré par enfoncement à chaud de cette pastille dans une masse (2) thermoplastique de l'objet, les faces latérales (1a) de la pastille étant reliées entre elles et/ou à la face active (3) de la pastille par des angles abattus ou arrondis (4, 13). |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_FR2750233A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>FR2750233A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_FR2750233A13</originalsourceid><addsrcrecordid>eNrjZFAKzk0sKlFITixKUSjPLMlQyMwrSU0vSixJTVFIzixKLs0s4WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8W5BRuamBkbGxo6GxkQoAQBjnCWa</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Smart card with integrated circuit</title><source>esp@cenet</source><creator>THEVENOT BENOIT ; SIETTLER SOPHIE ; LARCHEVESQUE ALAIN ; LETOURNEL JEAN LUC</creator><creatorcontrib>THEVENOT BENOIT ; SIETTLER SOPHIE ; LARCHEVESQUE ALAIN ; LETOURNEL JEAN LUC</creatorcontrib><description>The card has the integrated circuit chip (1) set into the thermoplastic material of the card when the plastic is heated. The lateral faces of the circuit chip are joined by chamfered or rounded angles (4). The chamfering or rounding of the edges of the circuit chip is formed while the chip is still part of a silicon wafer. The individual circuits are separated by a saw. The chamfering and rounding is implemented by an etching process, which is done before or after the chips are separated by sawing.
Objet portatif équipé d'une pastille (1) de circuit intégré par enfoncement à chaud de cette pastille dans une masse (2) thermoplastique de l'objet, les faces latérales (1a) de la pastille étant reliées entre elles et/ou à la face active (3) de la pastille par des angles abattus ou arrondis (4, 13).</description><edition>6</edition><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HANDLING RECORD CARRIERS ; PHYSICS ; PRESENTATION OF DATA ; RECOGNITION OF DATA ; RECORD CARRIERS ; SEMICONDUCTOR DEVICES</subject><creationdate>1997</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19971226&DB=EPODOC&CC=FR&NR=2750233A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19971226&DB=EPODOC&CC=FR&NR=2750233A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>THEVENOT BENOIT</creatorcontrib><creatorcontrib>SIETTLER SOPHIE</creatorcontrib><creatorcontrib>LARCHEVESQUE ALAIN</creatorcontrib><creatorcontrib>LETOURNEL JEAN LUC</creatorcontrib><title>Smart card with integrated circuit</title><description>The card has the integrated circuit chip (1) set into the thermoplastic material of the card when the plastic is heated. The lateral faces of the circuit chip are joined by chamfered or rounded angles (4). The chamfering or rounding of the edges of the circuit chip is formed while the chip is still part of a silicon wafer. The individual circuits are separated by a saw. The chamfering and rounding is implemented by an etching process, which is done before or after the chips are separated by sawing.
Objet portatif équipé d'une pastille (1) de circuit intégré par enfoncement à chaud de cette pastille dans une masse (2) thermoplastique de l'objet, les faces latérales (1a) de la pastille étant reliées entre elles et/ou à la face active (3) de la pastille par des angles abattus ou arrondis (4, 13).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HANDLING RECORD CARRIERS</subject><subject>PHYSICS</subject><subject>PRESENTATION OF DATA</subject><subject>RECOGNITION OF DATA</subject><subject>RECORD CARRIERS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1997</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAKzk0sKlFITixKUSjPLMlQyMwrSU0vSixJTVFIzixKLs0s4WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8W5BRuamBkbGxo6GxkQoAQBjnCWa</recordid><startdate>19971226</startdate><enddate>19971226</enddate><creator>THEVENOT BENOIT</creator><creator>SIETTLER SOPHIE</creator><creator>LARCHEVESQUE ALAIN</creator><creator>LETOURNEL JEAN LUC</creator><scope>EVB</scope></search><sort><creationdate>19971226</creationdate><title>Smart card with integrated circuit</title><author>THEVENOT BENOIT ; SIETTLER SOPHIE ; LARCHEVESQUE ALAIN ; LETOURNEL JEAN LUC</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_FR2750233A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>1997</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HANDLING RECORD CARRIERS</topic><topic>PHYSICS</topic><topic>PRESENTATION OF DATA</topic><topic>RECOGNITION OF DATA</topic><topic>RECORD CARRIERS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>THEVENOT BENOIT</creatorcontrib><creatorcontrib>SIETTLER SOPHIE</creatorcontrib><creatorcontrib>LARCHEVESQUE ALAIN</creatorcontrib><creatorcontrib>LETOURNEL JEAN LUC</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>THEVENOT BENOIT</au><au>SIETTLER SOPHIE</au><au>LARCHEVESQUE ALAIN</au><au>LETOURNEL JEAN LUC</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Smart card with integrated circuit</title><date>1997-12-26</date><risdate>1997</risdate><abstract>The card has the integrated circuit chip (1) set into the thermoplastic material of the card when the plastic is heated. The lateral faces of the circuit chip are joined by chamfered or rounded angles (4). The chamfering or rounding of the edges of the circuit chip is formed while the chip is still part of a silicon wafer. The individual circuits are separated by a saw. The chamfering and rounding is implemented by an etching process, which is done before or after the chips are separated by sawing.
Objet portatif équipé d'une pastille (1) de circuit intégré par enfoncement à chaud de cette pastille dans une masse (2) thermoplastique de l'objet, les faces latérales (1a) de la pastille étant reliées entre elles et/ou à la face active (3) de la pastille par des angles abattus ou arrondis (4, 13).</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre |
| recordid | cdi_epo_espacenet_FR2750233A1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING RECORD CARRIERS PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES |
| title | Smart card with integrated circuit |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-01T10%3A43%3A19IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=THEVENOT%20BENOIT&rft.date=1997-12-26&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EFR2750233A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |