Method of mounting an integrated circuit on a thin support
The invention relates to a method of manufacturing a thin semiconductor device. According to the invention, an inner frame (12) is formed, used to place an integrated circuit module (13) in an outer frame (11) which forms the periphery of the thin semiconductor device; the module (13) is placed in t...
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| creator | KODAI SYOJIRO KENKYUSHO ZAIRYO |
| description | The invention relates to a method of manufacturing a thin semiconductor device. According to the invention, an inner frame (12) is formed, used to place an integrated circuit module (13) in an outer frame (11) which forms the periphery of the thin semiconductor device; the module (13) is placed in the inner frame (12) in such a way that its electrode terminal surface is exposed to the outside; and the module (13) is fixed by filling the inside of the outer and inner frames with resin. The invention applies especially to integrated circuit cards.
L'invention concerne un procédé de fabrication d'un dispositif semi-conducteur mince. Selon l'invention, on forme un cadre interne (12) utilisé pour placer un module de circuit intégré (13) dans un cadre externe (11) qui forme le pourtour du dispositif semi-conducteur mince; on place le module (13) dans le cadre interne (12) de manière que sa surface de borne d'électrode soit exposée vers l'extérieur; et on fixe le module (13) en remplissant l'intérieur des cadres externe et interne par de la résine. L'invention s'applique notamment aux cartes à circuit intégré. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_FR2663783A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>FR2663783A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_FR2663783A13</originalsourceid><addsrcrecordid>eNrjZLDyTS3JyE9RyE9TyM0vzSvJzEtXSMxTyMwrSU0vSixJTVFIzixKLs0sUcjPU0hUKMnIzFMoLi0oyC8q4WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8W5BRmZmxuYWxo6GxkQoAQAIqC6T</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method of mounting an integrated circuit on a thin support</title><source>esp@cenet</source><creator>KODAI SYOJIRO ; KENKYUSHO ZAIRYO</creator><creatorcontrib>KODAI SYOJIRO ; KENKYUSHO ZAIRYO</creatorcontrib><description>The invention relates to a method of manufacturing a thin semiconductor device. According to the invention, an inner frame (12) is formed, used to place an integrated circuit module (13) in an outer frame (11) which forms the periphery of the thin semiconductor device; the module (13) is placed in the inner frame (12) in such a way that its electrode terminal surface is exposed to the outside; and the module (13) is fixed by filling the inside of the outer and inner frames with resin. The invention applies especially to integrated circuit cards.
L'invention concerne un procédé de fabrication d'un dispositif semi-conducteur mince. Selon l'invention, on forme un cadre interne (12) utilisé pour placer un module de circuit intégré (13) dans un cadre externe (11) qui forme le pourtour du dispositif semi-conducteur mince; on place le module (13) dans le cadre interne (12) de manière que sa surface de borne d'électrode soit exposée vers l'extérieur; et on fixe le module (13) en remplissant l'intérieur des cadres externe et interne par de la résine. L'invention s'applique notamment aux cartes à circuit intégré.</description><edition>5</edition><language>eng ; fre</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; BASIC ELECTRIC ELEMENTS ; BOOK COVERS ; BOOKBINDING ; CALCULATING ; COMPUTING ; COUNTING ; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILES ; HANDLING RECORD CARRIERS ; LOOSE LEAVES ; MOVABLE-STRIP WRITING OR READING APPARATUS ; PERFORMING OPERATIONS ; PHYSICS ; PRESENTATION OF DATA ; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES ; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR ; RECOGNITION OF DATA ; RECORD CARRIERS ; SEMICONDUCTOR DEVICES ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; SPECIAL PRINTED MATTER ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>1991</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19911227&DB=EPODOC&CC=FR&NR=2663783A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19911227&DB=EPODOC&CC=FR&NR=2663783A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KODAI SYOJIRO</creatorcontrib><creatorcontrib>KENKYUSHO ZAIRYO</creatorcontrib><title>Method of mounting an integrated circuit on a thin support</title><description>The invention relates to a method of manufacturing a thin semiconductor device. According to the invention, an inner frame (12) is formed, used to place an integrated circuit module (13) in an outer frame (11) which forms the periphery of the thin semiconductor device; the module (13) is placed in the inner frame (12) in such a way that its electrode terminal surface is exposed to the outside; and the module (13) is fixed by filling the inside of the outer and inner frames with resin. The invention applies especially to integrated circuit cards.
L'invention concerne un procédé de fabrication d'un dispositif semi-conducteur mince. Selon l'invention, on forme un cadre interne (12) utilisé pour placer un module de circuit intégré (13) dans un cadre externe (11) qui forme le pourtour du dispositif semi-conducteur mince; on place le module (13) dans le cadre interne (12) de manière que sa surface de borne d'électrode soit exposée vers l'extérieur; et on fixe le module (13) en remplissant l'intérieur des cadres externe et interne par de la résine. L'invention s'applique notamment aux cartes à circuit intégré.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BOOK COVERS</subject><subject>BOOKBINDING</subject><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FILES</subject><subject>HANDLING RECORD CARRIERS</subject><subject>LOOSE LEAVES</subject><subject>MOVABLE-STRIP WRITING OR READING APPARATUS</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>PRESENTATION OF DATA</subject><subject>PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES</subject><subject>PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR</subject><subject>RECOGNITION OF DATA</subject><subject>RECORD CARRIERS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>SPECIAL PRINTED MATTER</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1991</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDyTS3JyE9RyE9TyM0vzSvJzEtXSMxTyMwrSU0vSixJTVFIzixKLs0sUcjPU0hUKMnIzFMoLi0oyC8q4WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8W5BRmZmxuYWxo6GxkQoAQAIqC6T</recordid><startdate>19911227</startdate><enddate>19911227</enddate><creator>KODAI SYOJIRO</creator><creator>KENKYUSHO ZAIRYO</creator><scope>EVB</scope></search><sort><creationdate>19911227</creationdate><title>Method of mounting an integrated circuit on a thin support</title><author>KODAI SYOJIRO ; KENKYUSHO ZAIRYO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_FR2663783A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>1991</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BOOK COVERS</topic><topic>BOOKBINDING</topic><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FILES</topic><topic>HANDLING RECORD CARRIERS</topic><topic>LOOSE LEAVES</topic><topic>MOVABLE-STRIP WRITING OR READING APPARATUS</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>PRESENTATION OF DATA</topic><topic>PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES</topic><topic>PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR</topic><topic>RECOGNITION OF DATA</topic><topic>RECORD CARRIERS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>SPECIAL PRINTED MATTER</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>KODAI SYOJIRO</creatorcontrib><creatorcontrib>KENKYUSHO ZAIRYO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KODAI SYOJIRO</au><au>KENKYUSHO ZAIRYO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of mounting an integrated circuit on a thin support</title><date>1991-12-27</date><risdate>1991</risdate><abstract>The invention relates to a method of manufacturing a thin semiconductor device. According to the invention, an inner frame (12) is formed, used to place an integrated circuit module (13) in an outer frame (11) which forms the periphery of the thin semiconductor device; the module (13) is placed in the inner frame (12) in such a way that its electrode terminal surface is exposed to the outside; and the module (13) is fixed by filling the inside of the outer and inner frames with resin. The invention applies especially to integrated circuit cards.
L'invention concerne un procédé de fabrication d'un dispositif semi-conducteur mince. Selon l'invention, on forme un cadre interne (12) utilisé pour placer un module de circuit intégré (13) dans un cadre externe (11) qui forme le pourtour du dispositif semi-conducteur mince; on place le module (13) dans le cadre interne (12) de manière que sa surface de borne d'électrode soit exposée vers l'extérieur; et on fixe le module (13) en remplissant l'intérieur des cadres externe et interne par de la résine. L'invention s'applique notamment aux cartes à circuit intégré.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS BOOK COVERS BOOKBINDING CALCULATING COMPUTING COUNTING DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILES HANDLING RECORD CARRIERS LOOSE LEAVES MOVABLE-STRIP WRITING OR READING APPARATUS PERFORMING OPERATIONS PHYSICS PRESENTATION OF DATA PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SPECIAL PRINTED MATTER TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | Method of mounting an integrated circuit on a thin support |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-12T22%3A19%3A53IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KODAI%20SYOJIRO&rft.date=1991-12-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EFR2663783A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |