PROCEDE ET DISPOSITIF POUR APPLIQUER DES REVETEMENTS LIQUIDES A LA SURFACE DE PLAQUETTES A CIRCUITS IMPRIMES

A method and apparatus is provided for applying liquid coatings such as solder masks sequentially to both sides of a printed circuit board substrate whereby only one drying operation would be needed to dry the liquid coatings. An isolation platen having openings corresponding to the coated parts of...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	HAROLD R. JR. SUMNER
Format:	Patent
Sprache:	fre
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINING MACHINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS PRINTING PRINTING MACHINES OR PRESSES PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	A method and apparatus is provided for applying liquid coatings such as solder masks sequentially to both sides of a printed circuit board substrate whereby only one drying operation would be needed to dry the liquid coatings. An isolation platen having openings corresponding to the coated parts of the board is used to provide a space between the coated part and the opposite side of the platen.