PROCEDE D'ENCAPSULATION D'UN COMPOSANT ELECTRONIQUE AU MOYEN D'UNE RESINE SYNTHETIQUE

A method using one or several successive coatings of an active device (63), (64) by means of a synthetic resin (72); the resin used is on the basis of a product of the family of ethoxy bisphenol A dimethacrylates, to which is added a photo-initiator compound producing radicals by photo-scission or by intermolecular abstraction of hydrogen at a concentration lying between 0.2 and 3% and preferably near 1%, which is then irradiated by ultra-violet radiation (76), as the case may be through a transparent mould (70); Application: coating of semiconductor devices and more particularly optoelectronic devices.