DISPOSITIF A BUSE POUR FIXER DES COMPOSANTS A UN CIRCUIT IMPRIME OU ANALOGUE OU LES EN RETIRER ET BUSE PERFECTIONNEE UTILISABLE AVEC CE DISPOSITIF

CE DISPOSITIF COMPREND UN MOYEN DE CHAUFFAGE D'AIR QUI EST ENVOYE A L'INTERIEUR D'UNE BUSE 52 A PAROIS LATERALES 54 VERTICALES ENTOURANT UN COMPOSANT 22 A SOUDER OU A RETIRER; L'AIR CHAUFFE ARRIVANT PAR UN ORIFICE 28 RENCONTRE UNE PLAQUE DEFLECTRICE TRANSVERSALE 18 QUI L'OBLIGE A DESCENDRE LE LONG DES FACES INTERIEURES DES PAROIS LATERALES 54 DE FACON A ARRIVER DIRECTEMENT ET SIMULTANEMENT SUR TOUTES LES BORNES A SOUDER OU A DESSOUDER SITUEES A LA PERIPHERIE DU COMPOSANT 22, LA BUSE ETANT ESPACEE DU CIRCUIT PAR UN INTERVALLE 60 DE SORTIE D'AIR. Device for delivering heated fluid 20,30 to the sides of a component 22 to melt solder at terminals disposed at the periphery of the component. The device includes a nozzle 52 for delivering heated fluid generally in a first direction to the sides of the component, and a baffle 18 disposed within or above the nozzle for directing the heated fluid generally laterally with respect to the first direction prior to delivery of the heated fluid towards the sides of the component. The nozzle has downwardly extending sides 54, and the sides are dimensioned so that the component can be accommodated within the nozzle. The baffle produces good distribution and mixing of heated air above and about the terminals, and this avoids the generation of hot spots, and produces simultaneous or essentially simultaneous melting of the solder at all of the leads to facilitate quick and convenient attachment of the component to or removal of the component from a printed circuit board while the lower edges thereof are disposed at least below the body of the component such that heated fluid is forced through a constricted space as it passes the component terminals to thus optimize transfer of heat from the fluid to the solder at the terminals. A central suction part 46 may be provided.