ALLIAGE DE CUIVRE ET SA FABRICATION

A copper alloy is disclosed which comprises 0.01 to 1.0 wt. % of Cr, 0.01 to 8 wt. % of Sn, 0.001 to 5 wt. % of at least one of 0.001 to 5 wt. % of Zn, 0.001 to 0.5 wt. % of Mn and 0.001 to 0.2 wt. % of Mg and the remainder of Cu, the content of O2 therein being not more than 0.005 wt. %. A method o...

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Bibliographische Detailangaben
1. Verfasser:	YOSHIMASA OYAMA, MASATO ASAI, TORU TANIGAWA, SHIGEO SHINOZ
Format:	Patent
Sprache:	fre
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS METALLURGY SEMICONDUCTOR DEVICES TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	A copper alloy is disclosed which comprises 0.01 to 1.0 wt. % of Cr, 0.01 to 8 wt. % of Sn, 0.001 to 5 wt. % of at least one of 0.001 to 5 wt. % of Zn, 0.001 to 0.5 wt. % of Mn and 0.001 to 0.2 wt. % of Mg and the remainder of Cu, the content of O2 therein being not more than 0.005 wt. %. A method of manufacturing therefor is described wherein, after the hot processing or the heat treatment at 800 DEG to 950 DEG C., the alloy is cooled by passage through a region of 800 DEG to 400 DEG C. within 20 minutes, then following cold processing, heating treatment is carried out for at least 1 minute at 400 DEG to 650 DEG C. The alloy with the composition aforementioned is used as an alloy material for electric or electronic instruments.