PROCEDE DE BRASAGE A LA VAGUE ET CAPTEUR CAPILLAIRE DE BRASURE METTANT EN OEUVRE CE PROCEDE

L'INVENTION CONCERNE UN PROCEDE DE BRASAGE A LA VAGUE SUR UNE CARTE DE CIRCUITS IMPRIMES, DES COMPOSANTS DONT LES CONNEXIONS NE TRAVERSENT PAS LA CARTE.SELON CE PROCEDE, LES COMPOSANTS 2 PASSENT DANS LA VAGUE DE BRASURE 3. DANS CES CONDITIONS, POUR AMELIORER L'ECOULEMENT DE LA BRASURE JUSQ...

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1. Verfasser:	BERNARD LACRUCHE ET FRANCIS BONHOURE
Format:	Patent
Sprache:	fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE TRANSPORTING WELDING WORKING BY LASER BEAM
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Zusammenfassung:	L'INVENTION CONCERNE UN PROCEDE DE BRASAGE A LA VAGUE SUR UNE CARTE DE CIRCUITS IMPRIMES, DES COMPOSANTS DONT LES CONNEXIONS NE TRAVERSENT PAS LA CARTE.SELON CE PROCEDE, LES COMPOSANTS 2 PASSENT DANS LA VAGUE DE BRASURE 3. DANS CES CONDITIONS, POUR AMELIORER L'ECOULEMENT DE LA BRASURE JUSQU'AUX ELEMENTS A BRASER 11, 20, ON PREVOIT AU PREALABLE UNE ETAPE DE CREATION DE CAPTEURS CAPILLAIRES 27 PERMETTANT DE FACILITER CET ECOULEMENT.L'INVENTION PREVOIT EGALEMENT DES CAPTEURS CAPILLAIRES METTANT EN OEUVRE CE PROCEDE. 1. A device for soldering a component to a surface, said component having a first surface (26) provided with at least one connection stud (20) intended to be connected to at least one connection area (11) of one surface (10) of a substrate (1), the one or more connection studs (20) of the component and the one or more connection areas (11) of the substrate being located at the same side of the substrate relative to said surface (10) of the substrate (1), and the component having a second surface (24) located opposite the first surface (26), characterized in that the device comprises at least one metallized element (27) connecting each connection stud (20) to the second surface (24) and extending up to the second surface (24) of the component.