Ethylene!-vinyl! ester, pref. acetate, hot melt adhesive compsn. - contg. co:polyether ester-amide to improve temp. resistance

A compsn. comprises (1) a copolymer contg. at least 25 wt.% ethylene and at least a vinyl ester and (2) 0.5-20, pref. 2-10 wt.% of a copolyetheresteramode (I). The compsn. is claimed for use as (hot melt) adhesive. Inclusion of (I) improves the comport of the adhesive with increasing temp. (e.g. imp...

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Bibliographische Detailangaben
1. Verfasser:	PATRICK BORG
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A compsn. comprises (1) a copolymer contg. at least 25 wt.% ethylene and at least a vinyl ester and (2) 0.5-20, pref. 2-10 wt.% of a copolyetheresteramode (I). The compsn. is claimed for use as (hot melt) adhesive. Inclusion of (I) improves the comport of the adhesive with increasing temp. (e.g. improved peel strength, shear strength and creep resistance) without adversely affecting the melt viscosity and the softening pt. of the compsn. The compsn. is used for packaging, binding and in the wood industry. LA PRESENTE INVENTION A POUR OBJET DES COMPOSITIONS NOUVELLES A BASE DE COPOLYMERES D'ETHYLENE ET D'ESTER VINYLIQUE ET LEUR APPLICATION EN TANT QU'ADHESIFS.LES COMPOSITIONS SELON L'INVENTION CONTIENNENT DES COPOLYMERES A BASE D'ETHYLENE ET D'ACETATE DE VINYLE ET CONTIENNENT DE 0,5 A 20, DE PREFERENCE 2 A 10 EN PROPORTIONS PONDERALES D'UN COPOLYETHERESTERAMIDE.