SOUS-ENSEMBLE DISPOSITIF D'AFFICHAGE ELECTRO-OPTIQUE-CADRE DE MONTAGE ET MODULE DE DISPOSITIF D'HORLOGERIE L'INCORPORANT, AINSI QUE PROCEDE DE FABRICATION DU DISPOSITIF D'AFFICHAGE ELECTRO-OPTIQUE

L'INVENTION CONCERNE UN SOUS-ENSEMBLE POUR DISPOSITIF D'HORLOGERIE A AFFICHAGE ELECTRO-OPTIQUE.CE SOUS-ENSEMBLE COMPREND UN CADRE DE MONTAGE PORTANT UNE PASTILLE DE CIRCUIT INTEGRE ET POSSEDANT PLUSIEURS ELEMENTS CONDUCTEURS SEPARES QUI SONT CHACUN CONNECTES A LA PASTILLE ET SONT EXTERIEUREMENT FORMES EN DOIGTS DE CONTACT ELASTIQUES 20 SUIVANT UN SCHEMA QUI DEFINIT UNE ENCEINTE. IL COMPREND AUSSI UN DISPOSITIF D'AFFICHAGE 22, 24 PLACE DANS L'ENCEINTE ET DONT DES BORNES DE CONTACT 30 SONT EN CONTACT DE FROTTEMENT RESPECTIF AVEC LES DOIGTS DE CONTACT ELASTIQUES. The electrooptical display/lead frame subassembly comprises (a) a conductive lead frame having an integrated circuit chip supported thereon and having a plurality of conductor members terminating in a pattern of spaced resilient contact fingers defining an enclosure of selected shape therebetween and (b) an electrooptical display having a shape adapted to fit in the enclosure between the contact fingers and having spaced edge electrode contact terminals arranged such that each resilient contact finger of the lead frame frictionally engages a respective one of the electrode contact terminals to establish electrical connection and hold the display in position. Each edge contact terminal of the display comprises an inner metallized layer and a protective, conductive outer layer to minimize damage to the contact terminal resulting from frictional engagement with the resilient contact fingers of the lead frame. Preferably, the lead frame also has component conductor members which are configured to provide battery contacts, switch contacts and leads for electronic components such as capacitors, quartz crystal oscillator and the like. A module assembly incorporating the electrooptical display/lead frame subassembly into a simple package with other components is also provided for insertion in a timepiece case. The module assembly includes a front pod member and a rear pod member releasably held together and molded with various recesses, chambers, channels and other special features to accommodate the subassembly securely between the pod members.